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MÁY HÀN CHIP SET BGA BẰNG TAY ZM-R5860

  • Hàng chính hãng, mới 100%
  • Cung cấp hóa đơn GTGT, CO, CQ theo yêu cầu
  • Chính sách bảo hành tiêu chuẩn của hãng
  • Giao hàng toàn quốc
  • Hỗ trợ tư vấn, kỹ thuật 24/7

Liên hệ báo giá

MÁY HÀN CHIP SET BGA BẰNG TAY ZM-R5860

Main Features:

1.Adopt liner slide which makes X、Y、Z axis all can do high positioning accuracy and fast maneuverability.

2. PLC control, can save 50 groups profile and analyze instant temperatures curves, equipped with password protection and modify function. The temperature curves can be show on the touch screen. Instantly set and analyze temperature parameter according with repairment need.

3. There are 3 independent heating areas, the 1st and 2nd hot-air heaters, can be set many temperatures parameters and sections at the same time. The 3rd IR preheating, prevent the PCB motherboard cracking, and can be adjusted the power comsumption. Top heater can be adjusted freely; second heater can be adjusted up and down.

The machine operations be runned by human machine interface- high definition touch screen (Taiwan)

4. Offer all kinds of hot-air nozzle, it can rotate 360°, with magnet, easy to install and change, and offer customized service.

5. Choose imported high-precision K-type thermocouple, closed loop control and automatic temperature compensation system, combined PLC module for the precision control of temperature. Temperature controlled within ±3 °.

6. Use a V-groove flexible fixture for PCB positioning to protect the PCB from deformation when heated or cooled, and it can rework for any BGA package size.

7. Powerful cross-flow fan rapidly cool the PCB board, built-in vacuum pump and external vacuum suction pen, pick up the chips rapidly.

8 There is an alarming after desoldering & soldering, and it is settled alarming in advance.

9. CE certificate, with emergency stop and Automatic power-off protection device when abnormal accident happens.

10. It can save many temperature parameters, easy to repair same chips. And can repair lead or lead free chips, can meet repairment of laptop, xbox360, mobile, ps3 and other components on the motherboard.

1Total Power4800W
2Top heater800W
3Bottom heater2nd heater 1200W,3rd IR heater 2700W
4Power supplyAC220V±10%     50/60Hz
5Machine dimensionL635*W600*H560m3
6PositioningV-groove, PCB support can be adjusted in any direction with external universal fixture
7Temperature control(K Sensor) closed loop, independent heating, precision within±3°
8PCB sizeMax 410×370mmMin 20×20 mm
9Electrical selectionHighly sensitive temperature control module+Touch screen (Taiwan)+Delta PLC
10Weight40kg
11PackageWooden Box
12G.W.78KG
13Package dimensionL78*W78*H77cm.

 

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