MÁY HÀN CHIP SET BGA TỰ ĐỘNG ZM-R6300
1. Adopt ceramic honeycombs heating system, higher efficiency of thermal conversion
2. Adopt infrared ceramic plate radiator heating system, heating rapidly
3. Multi-mode of operation, Mounting, welding, de-welding in one key, easy operation
4. Seven segments of temperature control process, suitable for Lead free BGA Rework.
5. HD Optical alignment system can realize precise mounting of BGA chip.
6. Choose high accurate K-type thermocouple, precise temperature testing, generating Report of curves analysis automatically
7.Equipped with Camera monitor to inspect the RPC reflow process, to check the condition timely.
8.Built-in three-level smoke purification system, clean up the poisonous gas during operation
1. Power supply: AC 220V 50/60 Hz
2. Total power: Max 4700W
3.Top heater power: 600W
4.Bottom heater power: 600W
5.IR heater power:3300W
6.Hot air Heating Temp: 400℃(Max)
7.Max PCB Size: 470mm×370mm
8.Chip Size: 2×2mm–60×60mm
12.Color: Grey and Red