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MÁY KIỂM TRA 3D-SPI INSPIRE-510

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Liên hệ báo giá

MÁY KIỂM TRA 3D-SPI INSPIRE-510

Name: in-line 3D Solder Paste Inspection

Model: InSPIre-510

Specifications: monorail

Size: 480 x490 mm (Detection area)

Product Features

TECHNICAL PARAMETERS:

Inspection Principle: Sine white projection PMP inspection

Inspection type:Volume, area, height, XY offset, shape, etc.

Defect Types:shift, excessive solder, insufficient solder, offset, deformed shape, etc.

Smallest component size:01005.

Accuracy: XY=10 um,Height = 0.37 um.

Repeatability: height:≤1um (4 Sigma);volume/acreage:<1%(4 Sigma).

Maximum Loading PCB Size(X*Y):510x505mm.

Inspection Speed: 0.35 SEC/FOV.

Fiducial Detection Time: 0.3sec/piece.

Maximum inspection height:±450um (±1200umOption).

High precision industrial camera with high frame count.

RGB Tune patented technology.

D-lighting patented technology.

Dynamic and static warpage compensation.

Barcode function with traceability.

Badmark transfer function to mounters.

Access IMS system functions.

Operating System Support: Windows 7 Professional (64 bit).

Five-minute programming, one-click operation.

SPC process control.

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